MPC8250AZUMHBC

Overview

The MPC8250AZUMHBC is a PowerQUICC II communications processor based on the PowerPC G2 core. It operates at frequencies up to 200 MHz and features a dual-issue integer architecture with separate 16-Kbyte instruction and data caches. The device integrates a Communication Processor Module (CPM) for protocol handling, a PCI bridge supporting 32-bit/66 MHz buses, and a twelve-bank memory controller. It utilizes a 480-pin TBGA package and requires separate 1.8 V logic and 3.3 V I/O power supplies.

Feature Summary

• Dual-issue EC603e microprocessor core with floating-point unit
• Integrated Communication Processor Module with serial DMA channels
• PCI host bridge compliant with Specification Revision 2.2
• Twelve-bank memory controller with glueless interface support

Applications

• Telecommunications infrastructure equipment
• Network routing and switching systems
• Industrial control applications requiring high-speed serial interfaces

Procurement Notes

Verify component authenticity through authorized NXP distributors or certified secondary market suppliers. Confirm RoHS compliance status as manufacturing processes may vary by production date. Ensure proper ESD handling protocols are followed during storage and installation due to the sensitivity of the CMOS technology and fine-pitch ball grid array packaging.

Selection Notes

Select this processor for designs requiring integrated Ethernet and HDLC processing capabilities alongside a standard PowerPC architecture. Evaluate thermal management requirements carefully, as junction temperature limits depend on ambient conditions and board layer count. Verify that the system clock configuration supports the desired core-to-CPM frequency ratios for optimal performance balancing.

Part Context

This component belongs to the MPC82xx family of PowerQUICC II processors designed for embedded communication applications. It shares architectural similarities with the MPC8260 but offers specific pinout and feature variations tailored for distinct networking roles within the broader Freescale/NXP semiconductor portfolio.

Replacement Considerations

The MPC8250ACVRIHBC serves as a footprint-compatible alternative within the same product family.