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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8250AZUPIBC is a PowerQUICC II communications processor featuring a dual-issue EC603e core operating at 200 MHz. It integrates a 64-bit 60x bus, a 32-bit local bus, and a PCI bridge supporting up to 66 MHz. The device includes a Communications Processor Module (CPM) with Fast Ethernet controllers, Serial Communications Controllers, and TDM interfaces. It utilizes a 480-pin TBGA package with separate 1.8 V core and 3.3 V I/O supplies.
Feature Summary
- Dual-issue integer core with floating-point unit
- Integrated Communications Processor Module for protocol handling
- Supports multiple serial protocols including Ethernet and HDLC
- PCI host/agent bridge with DMA capabilities
Applications
- Network routers and switches
- Base station controllers
- Industrial communication gateways
- Telecom transmission equipment
Procurement Notes
Verify the specific suffix AZUPIBC against official NXP documentation to confirm package type and temperature range. Confirm that the component matches the original Freescale specifications as ownership has transferred. Ensure compatibility with existing board designs referencing the standard TBGA footprint.
Selection Notes
Select this processor for applications requiring high-performance embedded communications processing. It is suitable for systems needing integrated Ethernet and TDM support without external protocol chips. Consider thermal management requirements due to power dissipation characteristics at maximum frequencies.
Part Context
This component belongs to the PowerQUICC II family, designed for network infrastructure. It serves as a successor to earlier generations, offering improved performance through the EC603e core. The MPC8250 provides a balance of processing power and peripheral integration for demanding communication tasks.
Replacement Considerations
The MPC8260 is footprint-compatible but may require design adjustments for voltage or frequency differences. Verify electrical characteristics before substitution.
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