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MPC8255ACZUMHBB
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Product Detailed Parameters
- Description：IC MPU MPC82XX 266MHZ 480TBGA
- Series：MPC82xx
- Mfr：NXP USA Inc.
- Package：Tray,Tray
- Core Processor：PowerPC G2
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：266MHz
- Co-Processors/DSP：Communications; RISC CPM
- RAM Controllers：DRAM, SDRAM
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：10/100Mbps (3)
- SATA：-
- USB：-
- Voltage - I/O：3.3V
- Operating Temperature：-40°C ~ 105°C (TA)
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：480-LBGA Exposed Pad
- Supplier Device Package：480-TBGA (37.5x37.5)
- Additional Interfaces：I2C, SCC, SMC, SPI, UART, USART
- Grade：-
- Qualification：-
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Overview
The MPC8255ACZUMHBB is a PowerQUICC II integrated communications processor based on the EC603e core. It features a 32-bit architecture with a maximum clock frequency of 266 MHz and operates at a core supply voltage of 1.9–2.2 V. The device includes 16 kB instruction cache, 16 kB data cache, and 24 kB RAM. It utilizes a 480-TBGA package and supports interfaces including Ethernet, I2C, UART, SPI, and TDM.
Feature Summary
- Dual-issue integer core supporting frequencies up to 300 MHz
- Integrated Communications Processor Module (CPM) for flexible protocol support
- Separate power supplies for internal logic and I/O
- Independent PLLs for G2 core and CPM operation
Applications
- Telecommunications infrastructure equipment
- Network routing and switching devices
- Industrial control systems requiring high-speed serial communication
Procurement Notes
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm RoHS compliance status as indicated in official documentation. Check for moisture sensitivity level requirements during storage and handling. Ensure compatibility with existing board designs regarding voltage levels and pin configurations before procurement.
Selection Notes
Select this processor for applications requiring robust embedded communications capabilities. Consider the specific interface availability, such as limited Fast Communications Controllers compared to superset models. Evaluate thermal management needs due to power dissipation characteristics at higher clock speeds. Verify software support availability for the PowerPC architecture.
Part Context
This component belongs to the MPC82xx series of PowerQUICC II processors. It shares architectural similarities with the MPC8260 family but offers a reduced feature set regarding PCI bridges and ATM TC layers. It is designed for cost-sensitive embedded communication applications where full superset features are not required.
Replacement Considerations
Public confirmed substitute part numbers: None identified.
