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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8255AVVPIBB is a PowerQUICC II integrated communications processor based on the PowerPC G2 core. It features a single 32-bit core operating at frequencies up to 300 MHz with separate 16-Kbyte instruction and data caches. The device includes a Communications Processor Module (CPM) with two Fast Communications Controllers (FCCs), one Multichannel Controller (MCC), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), SPI, I2C, and four TDM interfaces. It utilizes a 480-ball TBGA package.
Feature Summary
- Dual-issue PowerPC G2 integer core with floating-point unit and MMU
- Integrated Communications Processor Module for flexible protocol support
- Separate power supplies for internal logic and I/O
- Independent PLLs for core and CPM frequency optimization
Applications
- Network routers and switches
- Industrial communication gateways
- Multi-service access platforms
Procurement Notes
Verify the specific suffix 'VVPIBB' against official NXP documentation to confirm pinout and voltage compatibility. Confirm RoHS compliance status as this component may be obsolete. Ensure the source document matches the exact part number before procurement to avoid functional mismatches due to hardware revisions.
Selection Notes
Select this processor for applications requiring high-speed serial communications and Ethernet integration without PCI bridge requirements. Evaluate thermal management needs as power dissipation increases significantly above 200 MHz. Verify that the system design accommodates the 480-TBGA package constraints and separate voltage supply requirements.
Part Context
This component belongs to the MPC82xx family, specifically the HiP4 generation of PowerQUICC II processors. It serves as a subset of the MPC8266, lacking the PCI bridge and ATM TC layer found in higher-end models while retaining essential serial communication capabilities for embedded networking tasks.
Replacement Considerations
Direct substitutes include other MPC82xxA series devices such as the MPC8250 or MPC8260, provided the application does not require the missing PCI or ATM features. Verify pin-to-pin compatibility and software register mapping differences before substitution.
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