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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8260ACVVMHBB is a PowerQUICC II integrated communications processor featuring a single-core 32-bit PowerPC G2 architecture. It operates at frequencies up to 266 MHz and utilizes a 480-TBGA package with dimensions of 37.5x37.5 mm. The device integrates a Communications Processor Module (CPM) for protocol offloading, a memory controller supporting DRAM and SDRAM, and interfaces including PCI, USB, Ethernet, and various serial controllers.
Feature Summary
- Integrates a dual-issue EC603e core with separate instruction and data caches
- Includes a RISC-based Communications Processor Module for peripheral task offloading
- Supports multiple communication protocols via Fast Communications Controllers and Serial Communications Controllers
- Features independent power supplies and PLLs for the core and I/O
Applications
- Wired infrastructure communications processing
- Wireless infrastructure communications processing
- High-end networking equipment such as routers and DSLAMs
- Telecom switching equipment and cellular base stations
Procurement Notes
Verify the specific suffix 'HBB' against official NXP documentation to confirm exact voltage, temperature, and packaging variants. Ensure compatibility with existing board designs regarding the 480-TBGA footprint and thermal requirements. Confirm that the component meets all necessary regulatory standards for the intended deployment environment.
Selection Notes
Select this processor for applications requiring high-performance embedded control combined with extensive layer 2 communications functionality. The integration of the CPM allows for significant reduction in external component count by handling serial protocols internally. Consider the available package options and clock configurations when designing the system architecture.
Part Context
This component belongs to the MPC82xx series of PowerQUICC II processors designed for communications applications. It shares architectural similarities with other members like the MPC8264 and MPC8265 but offers specific feature sets tailored for integrated host processing. The family is built on HiPerMOS technology to provide performance enhancements over previous generations.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers within the MPC82xx family. Verify pinout and functional compatibility before replacing components to ensure system integrity.
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