MPC8260ACVVMIBB

Overview

The MPC8260ACVVMIBB is a PowerQUICC II integrated communications processor utilizing the HiP4 0.13-micron process technology. It features a single 32-bit PowerPC G2 core operating at 266 MHz, paired with a RISC-based Communications Processor Module (CPM). The device includes a dual-issue integer core with separate 16-Kbyte data and instruction caches, an FPU, and MMU support. It provides a 64-bit 60x bus and a 32-bit local bus for memory interfacing. The package is a 480-TBGA (37.5x37.5 mm) with exposed pads.

Feature Summary

• Dual-issue EC603e microprocessor core with floating-point unit and hardware cache coherency
• Integrated Communications Processor Module (CPM) offloads peripheral tasks via serial DMAs and virtual DMA
• Separate power supplies and PLLs allow independent frequency optimization for the core and CPM
• Twelve-bank memory controller supports glueless interfaces to SRAM, SDRAM, DRAM, and Flash

Applications

• Wired and wireless infrastructure communications processing
• High-end routers and DSLAMs
• Telecom switching equipment and cellular base stations
• Remote access concentrators

Procurement Notes

Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm RoHS compliance and REACH registration details against current regulatory requirements. Validate pinout compatibility and thermal resistance specifications during integration planning. Ensure supply chain stability as this specific part number may require alternative sourcing strategies.

Selection Notes

Select this processor for applications requiring high-performance layer 2 forwarding combined with control plane processing. The architecture suits designs needing extensive protocol support including Ethernet, ATM, and HDLC. Consider the separate core and CPM clocking capabilities for power management. Evaluate the 480-TBGA package constraints for PCB layout and thermal dissipation requirements.

Part Context

This component belongs to the MPC82xx family of PowerQUICC II processors. It represents the HiP4 generation, succeeding earlier HiP3 devices like the MPC8260. The family shares software compatibility while offering performance increases and lower power consumption through the 0.13-micron process technology. It integrates PCI bridge functionality in superset models.

Replacement Considerations

Direct substitutes include MPC8265ACZUMIBC and MPC8266 variants within the same family. Migration from HiP3 MPC8260 requires attention to voltage changes and external filtering adjustments. Verify software compatibility and peripheral configuration differences when transitioning between specific model numbers.