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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray,Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8260AVVMHBB is a PowerQUICC II integrated communications processor utilizing the HiP4 .25μm process. It features a dual-issue G2 core operating at frequencies up to 300 MHz, equipped with separate 16-Kbyte data and instruction caches. The device includes a Communications Processor Module (CPM) for protocol handling, a memory controller supporting SRAM, SDRAM, and DRAM, and a System Interface Unit. Electrical specifications include a core supply voltage range of 1.7 V to 2.2 V depending on frequency, an I/O supply of 3.135 V to 3.465 V, and operation within a junction temperature range up to 105°C.
Feature Summary
- Dual-issue integer core with separate 16-Kbyte data and instruction caches
- Integrated Communications Processor Module (CPM) with serial DMA channels
- Twelve-bank memory controller supporting various memory types
- System Interface Unit (SIU) with clock synthesizer and watchdog timer
Applications
- Network routers and switches
- Multi-service access platforms
- Industrial communication gateways
Procurement Notes
Verify the specific suffix AVVMHBB against official NXP documentation to confirm package type, speed grade, and environmental rating. Confirm RoHS compliance status and lead times through authorized distributors. Ensure design-in compatibility with existing power supply rails and thermal management solutions before procurement.
Selection Notes
Select this component for applications requiring high-performance embedded processing with dedicated hardware communication capabilities. Consider the separate PLLs for core and CPM for independent frequency optimization. Evaluate thermal requirements based on estimated power dissipation tables in the datasheet, particularly for configurations exceeding 3 W.
Part Context
This part belongs to the MPC826xA family, which includes the MPC8255, MPC8264, MPC8265, and MPC8266. These devices share the same core architecture but differ in peripheral availability, such as PCI bridges or ATM TC layers. The MPC8260A serves as a baseline model within this series, offering standard communication interfaces without the superset features found in higher-end variants.
Replacement Considerations
Direct pin-compatible replacements within the same family include the MPC8264A, MPC8265A, and MPC8266A, which offer additional peripherals like PCI bridges or ATM support. Verify that the target application utilizes only the features present in the MPC8260A to ensure functional equivalence.
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