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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8260AVVPJDC is a PowerQUICC II integrated communications processor based on the PowerPC G2 core. It features a dual-issue EC603e microprocessor with separate 16-Kbyte instruction and data caches, supporting frequencies up to 300 MHz. The device includes a Communications Processor Module (CPM) for protocol handling, a System Interface Unit (SIU), and a memory controller. It utilizes a 480-pin TBGA package and operates with core supply voltages ranging from 1.7 V to 2.24 V depending on frequency.
Feature Summary
- Dual-issue integer core with PowerPC architecture-compliant MMU
- Integrated Communications Processor Module (CPM)
- Separate power supplies for internal logic and I/O
- Independent PLLs for G2 core and CPM
Applications
- Network routers and switches
- Multi-service access platforms
- Industrial communication gateways
Procurement Notes
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm RoHS compliance and lead-free specifications against current datasheet revisions. Validate package integrity and pin alignment prior to integration into PCB designs.
Selection Notes
Select this model for applications requiring high-performance embedded processing with dedicated hardware protocol support. Ensure system design accommodates the specific voltage requirements for core and I/O supplies. Consider thermal management strategies given the power dissipation characteristics at maximum operating frequencies.
Part Context
This component belongs to the MPC82xxA family of PowerQUICC II processors manufactured by NXP Semiconductors. It represents an evolution in the MPC8260 series, offering enhanced performance through HiP4 process technology compared to earlier iterations.
Replacement Considerations
Direct substitutes include other MPC826xA family members such as MPC8265 or MPC8266, provided their additional peripheral sets like PCI bridges are compatible with the target application requirements.
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