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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8264AZUPIBB is a PowerQUICC II integrated communications processor based on the PowerPC G2 core. It features a dual-issue integer core with separate 16-Kbyte data and instruction caches, operating at frequencies up to 300 MHz. The device includes a Communications Processor Module (CPM) with a 32-Kbyte dual-port RAM, three Fast Communications Controllers (FCCs), two Multichannel Controllers (MCCs), four Serial Communications Controllers (SCCs), and two Serial Management Controllers (SMCs). It supports ATM TC layer functions via eight TDM ports and provides a 64-bit 60x bus and a 32-bit local bus.
Feature Summary
- Integrated Communications Processor Module (CPM) supporting flexible protocol handling through dedicated controllers
- Hardware-based ATM Transfer Convergence (TC) layer for inverse multiplexing and cell processing
- Dual independent Phase-Locked Loops allowing separate frequency optimization for the core and CPM
- Comprehensive serial interface suite including Ethernet, HDLC, UART, SPI, I2C, and TDM capabilities
Applications
- ATM network infrastructure equipment requiring inverse multiplexing
- High-speed telecommunications gateways and routers
- Industrial control systems utilizing TDM interfaces
- Embedded communication modules requiring integrated Ethernet and serial protocols
Procurement Notes
Verify the specific suffix 'ZUPIBB' against official NXP documentation to confirm package type, temperature range, and lead-free status. Ensure compatibility with existing PCB footprints for the TBGA package. Confirm that the component meets required RoHS and REACH compliance standards for your target market. Check for any obsolescence notices or lifecycle changes associated with this specific ordering code.
Selection Notes
Select this processor when system requirements demand high-throughput serial communications combined with ATM TC layer hardware acceleration. It is suitable for designs needing independent clock domains for the CPU and communication peripherals. Consider thermal management requirements as power dissipation increases with higher clock multipliers. Verify memory controller support for the intended SRAM or SDRAM types.
Part Context
This component belongs to the MPC826xA family of PowerQUICC II processors, which also includes the MPC8260, MPC8255, MPC8265, and MPC8266. These devices share a common architecture but differ in peripheral availability, such as the presence of PCI bridges or specific numbers of TDM ports. The MPC8264 specifically integrates the ATM TC layer functionality not found in all family members.
Replacement Considerations
Direct substitutes within the same family include the MPC8260AEC and MPC8266AEC, though pinouts and peripheral sets may vary. Cross-family replacements require careful evaluation of software compatibility and peripheral mapping differences.
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