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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8265ACVVMIBC is a PowerQUICC II integrated communications processor from the MPC826xA family, manufactured by NXP USA Inc. It features a single-core 32-bit PowerPC G2 microprocessor running at 300 MHz. The device utilizes a .25μm HiP4 process and includes a Communication Processor Module (CPM) for flexible protocol support. Key interfaces include a 60x bus, a local bus, and a PCI bridge supporting up to 66 MHz. Memory controllers support DRAM and SDRAM. The component is housed in a 480-TBGA package with dimensions of 37.5x37.5 mm.
Feature Summary
- Dual-issue integer core with separate 16-Kbyte data and instruction caches
- Integrated Communications Processor Module (CPM) with serial DMA channels
- On-chip 60x-to-PCI bridge compliant with PCI Specification Revision 2.2
- Twelve-bank memory controller with glueless interface to SRAM, SDRAM, and DRAM
Applications
- Enterprise networking equipment
- Telecom transmission and switching systems
- Storage infrastructure controllers
Procurement Notes
Verify the specific suffix 'AVVMIBC' against official NXP documentation to confirm voltage, temperature range, and package details. Confirm current product status as the MPC826xA family has reached end-of-life. Ensure compatibility with existing board designs regarding power supply sequencing and thermal management requirements specified in the hardware manual.
Selection Notes
Select this component for applications requiring high-speed communication processing with integrated PCI connectivity. Consider the 300 MHz operating frequency and the availability of the CPM for handling complex protocols like Ethernet and ATM. Evaluate thermal dissipation needs given the estimated power consumption at maximum frequencies and ensure the PCB layout supports the required bypassing and trace lengths.
Part Context
This part belongs to the MPC826xA series, which also includes the MPC8260, MPC8255, MPC8264, and MPC8266. These devices share the same core architecture but differ in peripheral integration, such as the presence of the PCI bridge in the MPC8265 and MPC8266 models. The series is designed for scalable communications processing performance using the Power Architecture core.
Replacement Considerations
NXP USA Inc.
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