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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8265ACZUMHBC is a PowerQUICC II integrated communications processor based on the EC603e core. It features a dual-issue integer core with separate 16-Kbyte data and instruction caches, a floating-point unit, and an MMU. The device includes a Communications Processor Module (CPM) with 32-Kbyte dual-port RAM, three Fast Communications Controllers (FCCs), two Multichannel Controllers (MCCs), four Serial Communications Controllers (SCCs), and two Serial Management Controllers (SMCs). It integrates a 60x-to-PCI bridge supporting 66 MHz operation, a system interface unit, and a twelve-bank memory controller.
Feature Summary
- Integrated 60x-to-PCI bridge for host connectivity
- Communications Processor Module with extensive serial controllers
- Dual independent PLLs for core and CPM frequency optimization
- Separate power supplies for internal logic and I/O
Applications
- Telecommunications infrastructure equipment
- Network routing and switching systems
- ATM network interfaces
- Industrial control systems requiring high-speed serial communication
Procurement Notes
Verify the specific suffix 'HBC' against official NXP documentation to confirm package type, temperature range, and lead-free status. Ensure compatibility with existing PCB layouts regarding the TBGA-480 footprint and voltage requirements. Confirm end-of-life or obsolescence status through authorized distributors before finalizing procurement plans.
Selection Notes
Select this component when PCI bus integration is required alongside high-throughput serial communications. The MPC8265 offers a superset of features compared to the MPC8260, specifically adding the PCI bridge. Evaluate thermal management needs as power dissipation increases with clock frequency. Consider the separate power supply requirements for VDD and VDDH during system design.
Part Context
This part belongs to the MPC826xA family of PowerQUICC II processors. It shares architectural similarities with the MPC8260, MPC8264, and MPC8266 but is distinguished by its inclusion of the 60x-to-PCI bridge functionality. The HiP4 process technology enables higher operating frequencies and improved performance metrics within the embedded communications processor category.
Replacement Considerations
The MPC8260AEC datasheet lists the MPC8260, MPC8255, MPC8264, and MPC8266 as related devices in the same family. Substitution requires verification of feature parity, particularly regarding the presence or absence of the PCI bridge and specific controller counts.
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