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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8265ACZUMIBC is a PowerQUICC II integrated communications processor utilizing the EC603e core. It features a 480-pin TBGA package with dimensions of 37.5 x 37.5 mm and a height of 1.70 mm. The device supports a maximum clock frequency of 66.66 MHz, operates at 300 MHz core speed, and includes a floating-point unit. It utilizes a 64-bit external data bus and a 32-bit address bus.
Feature Summary
- Integrated PCI bridge supporting host and agent modes with DMA capabilities
- Dual-issue integer core with separate instruction and data caches
- Communications Processor Module with multiple serial controllers
- Separate power supplies for internal logic and I/O
Applications
- Enterprise networking equipment
- Telecom transmission systems
- Wireless infrastructure control planes
Procurement Notes
Verify the specific revision level against the datasheet MPC8260AEC Rev. 2.0 to ensure compatibility with required voltage levels and timing specifications. Confirm that the 480-pin TBGA footprint matches the target PCB design constraints. Check RoHS compliance status as indicated in distributor records, noting potential variations between manufacturing lots.
Selection Notes
Select this component when a dedicated PCI interface is required alongside high-speed serial communications. The inclusion of the PCI bridge distinguishes it from similar family members lacking this feature. Ensure the system design accommodates the specific thermal resistance requirements for the TBGA package under expected ambient conditions.
Part Context
This part belongs to the MPC826xA family, which shares the HiP4 process technology. It is functionally related to the MPC8260, MPC8264, and MPC8266, differing primarily in the integration of the PCI bridge and specific peripheral configurations. It serves as an intermediate option within the PowerQUICC II series.
Replacement Considerations
MPC8265AVVMHBC
FAQ
Does the MPC8265 include a PCI bridge?
Yes, the MPC8265 integrates a 60x-to-PCI bridge compliant with PCI Specification Revision 2.2.
What is the package type for this model?
The MPC8265ACZUMIBC uses a 480-pin Thin Ball Grid Array (TBGA) package.
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