MPC8265AVVPIBC

Overview

The MPC8265AVVPIBC is a PowerQUICC II integrated communications processor based on the PowerPC G2 core. It features a single 32-bit core operating at 300 MHz within the MPC82xx family. The device utilizes a 480-ball TBGA package measuring 37.5x37.5 mm with an exposed pad. It supports I/O voltages of 3.3 V and operates within an ambient temperature range of 0°C to 105°C.

Feature Summary

• Integrates a dual-issue PowerPC G2 integer core with separate 16-Kbyte data and instruction caches.
• Includes a dedicated Communications Processor Module (CPM) for flexible protocol support.
• Features an on-chip 60x-to-PCI bridge compliant with PCI Specification Revision 2.2.
• Provides a twelve-bank memory controller supporting SRAM, SDRAM, DRAM, and Flash.

Applications

• Integrated communications processors
• Network infrastructure equipment
• Industrial control systems

Procurement Notes

Verify component authenticity through authorized NXP channels due to obsolete status. Confirm RoHS compliance and lead-free specifications against current manufacturing records. Validate package dimensions and pinout compatibility during integration planning.

Selection Notes

Select this model for applications requiring high-speed PCI connectivity alongside embedded communications processing. Ensure system design accommodates the specific voltage requirements for core logic and I/O interfaces. Evaluate thermal management strategies given the power dissipation characteristics of the HiP4 process technology.

Part Context

This component belongs to the MPC826xA family, which includes devices like the MPC8260, MPC8255, MPC8264, and MPC8266. These processors utilize .25μm HiP4 process technology and are designed for high-performance embedded networking and communications tasks.

Replacement Considerations

Public confirmed substitute part numbers: None available.