— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8270CVRMIBA is a PowerQUICC II integrated communications processor utilizing the G2_LE core variant of the EC603e microprocessor. It features a 32-bit data bus and 18-bit address local bus, with separate power supplies for internal logic (1.45–1.60 V) and I/O (3.135–3.465 V). The device supports frequencies up to 450 MHz on the CPU and 300 MHz on the CPM. It includes 16 KB instruction and data caches, a PCI bridge compliant with Specification Revision 2.2, and USB 2.0 full/low rate support. The package is a lead-free 516-pin PBGA.
Feature Summary
- Integrated Communications Processor Module (CPM) off-loads peripheral tasks from the embedded core, supporting protocols such as Ethernet, HDLC, and ATM via UTOPIA interfaces.
- Features a dual-issue integer core with floating-point unit capabilities and independent PLLs for optimizing core and CPM frequencies separately.
- Includes a 60x-to-PCI bridge supporting DMA for memory block transfers and hot-swap functionality compliant with PICMG standards.
- Provides glueless interface to SRAM, SDRAM, DRAM, and Flash through a 12-bank memory controller with programmable bank sizes.
Applications
- High-end communications and networking equipment
- Routers and DSLAMs
- Remote access concentrators
- Telecom switching equipment
- Cellular base stations
Procurement Notes
Verify the specific ordering suffix 'VR' confirms the 516-pin lead-free PBGA package and commercial temperature range. Confirm RoHS compliance status directly with NXP Semiconductors documentation. Ensure design-in compatibility with existing PowerQUICC II software drivers due to architectural continuity within the family.
Selection Notes
Select this component for applications requiring high-performance layer 2 processing combined with control plane functions. The MPC8270 offers extensive serial communication controllers and fast communication controllers suitable for complex protocol handling. Consider thermal management requirements given the estimated power dissipation at higher clock speeds.
Part Context
This part belongs to the HiP7 PowerQUICC II family, which also includes the MPC8275 and MPC8280. These devices share a common architecture but differ in feature sets such as UTOPIA ports and Transmission Convergence layers. The MPC8270 specifically lacks the TC layer and IMA capabilities found in the MPC8280.
Replacement Considerations
Public confirmed substitute part numbers: MPC8275VR, MPC8275ZQ, MPC8280EC.
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