— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 450MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:450MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8270CVVUPEA is a PowerQUICC II integrated communications processor utilizing the HiP7 0.13-micron process. It features a G2_LE core operating at frequencies up to 450 MHz and a Communications Processor Module (CPM) running up to 300 MHz. The device includes a 64-bit data bus, 32-bit address bus, and separate 16 KB instruction and data caches. It supports USB 2.0, PCI bridge functionality, three Fast Communication Controllers (FCCs), four Serial Communication Controllers (SCCs), two Multi-channel Controllers (MCCs), and three 10/100 Ethernet interfaces within a 480-pin TBGA package.
Feature Summary
- Integrated G2_LE core with floating-point unit and dual-issue capability for high-performance processing
- Dedicated Communications Processor Module (CPM) offloads peripheral tasks and protocol handling from the main core
- Supports multiple serial protocols including ATM, HDLC, and Ethernet via FCCs, SCCs, and MCCs
- Includes USB 2.0 controller and PCI bridge for system interconnectivity
Applications
- Wired and wireless infrastructure communications processing
- High-end routers and DSLAMs
- Telecom switching equipment and cellular base stations
- Remote access concentrators
Procurement Notes
Verify the specific ordering suffix CVVUPEA against the manufacturer's current documentation to confirm package type and lead-free status. Confirm availability as this component may be subject to end-of-life restrictions or limited distribution channels. Ensure compatibility with existing board designs regarding the 480 TBGA footprint and voltage requirements before procurement.
Selection Notes
Select this processor for applications requiring robust layer 2 functionality combined with control plane processing. The separation of power supplies for internal logic and I/O allows for optimized power management. Consider the specific interface requirements such as UTOPIA ports, which are not present on the MPC8270 but available on higher-tier family members like the MPC8280.
Part Context
This component belongs to the MPC8280 PowerQUICC II family, which also includes the MPC8275 and MPC8280. These devices share the same core architecture and CPM but differ in feature sets and package options. The MPC8270 specifically lacks the Transmission Convergence (TC) layer and Inverse Multiplexing for ATM (IMA) capabilities found in the MPC8280.
Replacement Considerations
Direct substitutes within the same family include the MPC8275 and MPC8280, though these offer additional features such as UTOPIA ports and TC layers. Verify that the increased feature set does not introduce pinout incompatibilities or software configuration conflicts with the existing design.
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