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Product Detailed Parameters
- Description:IC MPU MPC82XX 333MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:333MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8270CZQMIBA is a PowerQUICC II integrated communications processor based on the .13µm HiP7 process. It features a dual-issue G2_LE core with a floating-point unit, operating at frequencies up to 450 MHz. The device includes a 32-bit RISC Communications Processor Module (CPM) and supports PCI bus speeds up to 66 MHz. Key peripherals include three Fast Communication Controllers (FCCs), four Serial Communication Controllers (SCCs), two Multi-Channel Controllers (MCCs), and a USB 2.0 controller. It utilizes a 516-pin PBGA package with lead spheres.
Feature Summary
- Dual-issue integer core with separate instruction and data caches
- Integrated Communications Processor Module for flexible protocol support
- PCI bridge supporting host and peripheral modes
- Multiple serial communication controllers including Ethernet and HDLC
Applications
- Telecommunications infrastructure equipment
- Network routing and switching systems
- Industrial control applications requiring high reliability
Procurement Notes
Verify the specific ordering suffix against the manufacturer's current documentation to confirm package type and temperature range. Ensure compatibility with existing board designs regarding power supply requirements and pin configurations. Confirm availability status as this component may be subject to end-of-life restrictions.
Selection Notes
Select this processor for applications requiring robust communication protocols and high-performance processing. Consider the specific package variant when designing PCB layouts. Evaluate thermal management requirements based on the estimated power dissipation values provided in the hardware specifications.
Part Context
This component belongs to the MPC8280 family of PowerQUICC II processors. It shares architectural similarities with the MPC8275 and MPC8280 but offers a specific configuration of communication interfaces. The ZQ package designation indicates a 516-pin Plastic Ball Grid Array with lead spheres.
Replacement Considerations
Compatible substitutes within the same family include the MPC8275 and MPC8280, though feature sets differ. Verify functional equivalence before substitution.
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