MPC8270VVUPEA

Overview

The MPC8270VVUPEA is a PowerQUICC II integrated communications processor utilizing the HiP7 0.13-micron process technology. It features an embedded EC603e core with a floating-point unit, operating at frequencies up to 450 MHz. The device includes a Communications Processor Module (CPM) for offloading peripheral tasks and supports protocols such as Ethernet, HDLC, and ATM. Key specifications include 16 KB instruction and data caches, three Fast Communication Controllers (FCCs), four Serial Communication Controllers (SCCs), one Multi-Channel Controller (MCC), PCI bridge capabilities, and USB 2.0 support. It utilizes a 480-pin lead-free TBGA package.

Feature Summary

• Integrated EC603e core with floating-point unit and dual-issue capability
• Communications Processor Module (CPM) supporting multiple serial protocols
• PCI bridge compliant with Specification Revision 2.2
• USB 2.0 full/low rate controller with host and slave modes

Applications

• Wired and wireless infrastructure communications processing
• High-end routers and DSLAMs
• Telecom switching equipment
• Cellular base stations

Procurement Notes

Verify component authenticity through authorized NXP channels or certified distributors. Confirm RoHS compliance status and check for moisture sensitivity labeling prior to soldering. Ensure proper ESD handling procedures are followed during storage and assembly. Review the latest datasheet revision for any updates to electrical characteristics or ordering information.

Selection Notes

Select this processor for applications requiring high-performance layer 2 forwarding combined with control plane processing. Consider the specific package availability, as the VV suffix denotes a lead-free 480-pin TBGA variant. Evaluate thermal management requirements based on estimated power dissipation tables in the hardware specifications. Ensure software compatibility with existing PowerQUICC II family codebases.

Part Context

This component belongs to the MPC8280 PowerQUICC II family, which also includes the MPC8275 and MPC8280 models. These devices share a common architecture but differ in feature sets and package options. The MPC8270 specifically lacks UTOPIA ports and Transmission Convergence layers found in higher-tier models like the MPC8280. All members utilize the same HiP7 process technology.

Replacement Considerations

Direct substitutes within the same family include the MPC8270VRMIBA (516 PBGA package) or MPC8270ZQ (516 PBGA with lead spheres). Cross-package replacements require PCB redesign due to pin count differences. Verify that alternative packages maintain required interface counts such as FCCs and SCCs.