— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 450MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:450MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8270ZUUPEA is a PowerQUICC II integrated communications processor utilizing the G2_LE core. It features a 16 KB instruction cache and a 16 KB data cache, both four-way set associative with LRU replacement. The device includes three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), one Multi-Channel Controller (MCC), and a PCI bridge. It supports USB 2.0 full/low rate and operates on separate power supplies for internal logic and I/O.
Feature Summary
- Dual-issue integer core supporting frequencies up to 450 MHz
- Integrated PCI bridge compliant with Specification Revision 2.2
- Communications Processor Module with embedded 32-bit RISC microcontroller
- Separate PLLs for core and CPM frequency optimization
Applications
- High-performance network infrastructure equipment
- Telecommunications base stations
- Industrial control systems requiring robust serial interfaces
Procurement Notes
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity as the ZU variant uses leaded solder. Ensure compatibility with existing PCB layouts given the specific 480 TBGA pinout configuration.
Selection Notes
Select this model when PCI connectivity and multiple serial protocols are required without UTOPIA ATM support. Compare against MPC8275 or MPC8280 if additional TDM ports or ATM capabilities are necessary. Validate thermal management requirements for the 480 TBGA package under maximum load conditions.
Part Context
Part of the MPC8280 PowerQUICC II family manufactured using .13µm HiP7 technology. This specific SKU denotes the standard ZU package variant which utilizes leaded solder balls in a 480-ball Thin Ball Grid Array format.
Replacement Considerations
No direct public substitutes listed. Consider MPC8275VR or MPC8275ZQ for similar functionality with different package types.
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