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MPC8272CZQTIEA
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Product Detailed Parameters
- Description：IC MPU MPC82XX 400MHZ PBGA516
- Series：MPC82xx
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：PowerPC G2_LE
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：400MHz
- Co-Processors/DSP：Communications; RISC CPM, Security; SEC
- RAM Controllers：DRAM, SDRAM
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：10/100Mbps (2)
- SATA：-
- USB：USB 2.0 (1)
- Voltage - I/O：3.3V
- Operating Temperature：-40°C ~ 105°C (TA)
- Security Features：Cryptography, Random Number Generator
- Mounting Type：Surface Mount
- Package / Case：516-BBGA
- Supplier Device Package：516-PBGA (27x27)
- Additional Interfaces：I2C, SCC, SMC, SPI, UART, USART
- Grade：-
- Qualification：-
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Overview
The MPC8272CZQTIEA is a PowerQUICC II integrated communications processor featuring a G2_LE core and CPM. It includes dual Fast Ethernet MACs, USB 2.0, PCI bridge, and Security Engine (SEC). The device operates at frequencies up to 400 MHz with 16 KB I/D caches. It utilizes a 516-pin ZQ PBGA package with lead spheres. Supply voltages are 1.5 V for logic and 3.3 V for I/O. Operating temperature ranges from -40°C to 105°C.
Feature Summary
- Integrated security engine supporting hardware encryption algorithms
- Dual-issue integer core with floating-point unit support
- Communications processor module offloading peripheral tasks
- USB 2.0 full/low rate host and slave mode capabilities
Applications
- Small and medium enterprise routers
- Virtual private network equipment
- Wireless access points
- Industrial control systems
Procurement Notes
Verify the specific ordering suffix against official NXP documentation to confirm package type and environmental ratings. Confirm component availability status as this family may be discontinued. Ensure compatibility with existing board designs regarding voltage levels and pin configurations before procurement.
Selection Notes
Select this component for applications requiring high integration of communication protocols and hardware security. Evaluate thermal management requirements based on estimated power dissipation data. Consider the 516-pin BGA package constraints during PCB layout planning. Verify that the required clock frequencies align with the internal multiplier capabilities.
Part Context
This part belongs to the MPC8272 PowerQUICC II family, which also includes MPC8247, MPC8248, and MPC8271 variants. These devices share similar architectures but differ in feature sets such as the presence of the security engine or ATM support. The ZQ package variant specifically uses lead spheres instead of lead-free solder balls found in VR packages.
Replacement Considerations
MPC8272VRMIBA is a pin-compatible alternative within the same family using a different package type.
