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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8275CVRMIBA is a PowerQUICC II System-on-Chip microprocessor manufactured by NXP Semiconductors. It features a single-core 32-bit PowerPC G2_LE processor running at 266 MHz, housed in a 516-pin PBGA package. The device includes 16 kB instruction and 16 kB data L1 caches, operates on a core voltage of 1.45 V to 1.6 V, and supports an I/O voltage range of 3.135 V to 3.465 V.
Feature Summary
- Integrated dual-issue integer core with floating-point unit
- Communications Processor Module for protocol offloading
- PCI bridge supporting host or peripheral modes
- Memory controller compatible with DRAM and SDRAM
Applications
- Wired infrastructure communications processing
- Wireless infrastructure base stations
- High-end networking equipment routers
- DSLAMs and remote access concentrators
Procurement Notes
Verify the specific ordering suffix against official documentation to confirm package type and temperature rating. Confirm RoHS compliance status through manufacturer certificates. Ensure compatibility with existing PCB footprints and power delivery networks before procurement.
Selection Notes
Select this component for applications requiring high-performance embedded control combined with extensive layer 2 communications processing. Evaluate thermal management requirements based on estimated power dissipation tables. Verify software compatibility with the broader PowerQUICC II family architecture.
Part Context
This part belongs to the MPC82xx series of integrated communications processors. It utilizes HiPerMOS7 0.13-micron process technology to deliver performance enhancements over previous generations while maintaining full software compatibility with the PowerQUICC II family.
Replacement Considerations
Consult official substitution lists for verified alternatives within the MPC82xx family. Cross-reference pinouts and electrical characteristics carefully when considering variants like the MPC8270 or MPC8280.
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