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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8275CZQMIBA is a PowerQUICC II System-on-Chip utilizing the G2_LE core with a maximum frequency of 266 MHz. It features a 32-bit architecture, 16 KB instruction cache, and 16 KB data cache. The device includes three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Multi-channel Controllers (MCCs), and one Universal Serial Bus (USB) 2.0 controller. It operates on a 1.45 V to 1.60 V core supply and 3.135 V to 3.465 V I/O supply within an ambient temperature range of 0°C to 70°C.
Feature Summary
- Integrated dual-issue G2_LE core supporting floating-point operations
- Communications Processor Module (CPM) for protocol offloading
- Support for ATM via UTOPIA interfaces
- PCI bridge compliant with PCI Specification Revision 2.2
Applications
- Wired and wireless infrastructure communications processing
- High-end routers and DSLAMs
- Telecom switching equipment
- Cellular base stations
Procurement Notes
Verify the specific ordering suffix 'ZQ' indicates lead spheres in the 516 PBGA package. Confirm the device status against current NXP lifecycle notices as older revisions may be discontinued. Ensure compatibility with required voltage levels and thermal management solutions for the specified operating conditions.
Selection Notes
Select this component when high-speed serial communication protocols like ATM and HDLC are required alongside Ethernet connectivity. The integrated CPM reduces processor load by handling peripheral tasks. Verify that the 516-pin BGA package fits the board layout constraints and that the 266 MHz performance meets system throughput requirements.
Part Context
This part belongs to the MPC82xx family of PowerQUICC II processors manufactured using 0.13-micron HiPerMOS7 technology. It shares architectural similarities with the MPC8270 and MPC8280 but offers specific interface configurations tailored for telecommunications applications requiring extensive serial channel support.
Replacement Considerations
Check for MPC8275VRMIBA or MPC8270 variants if different package types or temperature ranges are needed. Verify software compatibility across the MPC82xx family before substitution.
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