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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8275VRMIBA is a PowerQUICC II System-on-Chip microprocessor utilizing the G2_LE core based on the EC603e architecture. It operates at frequencies up to 266 MHz with a 1.45 V to 1.60 V core supply voltage and 3.135 V to 3.465 V I/O voltage. The device features a 32-bit data bus, 16 KB instruction cache, and 16 KB data cache. Key peripherals include four Serial Communications Controllers (SCCs), three Fast Communication Controllers (FCCs), one Multi-Channel Controller (MCC), PCI bridge support, USB 2.0 full/low rate, and Ethernet interfaces.
Feature Summary
- Integrated Communications Processor Module (CPM) offloads peripheral tasks using a 32-bit RISC architecture.
- Supports multiple communications protocols including Ethernet, ATM via UTOPIA, and HDLC.
- Features separate power supplies for internal logic and I/O with independent PLLs for core and CPM optimization.
Applications
- Wired and wireless infrastructure communications processing
- High-end routers and DSLAMs
- Telecom switching equipment and cellular base stations
Procurement Notes
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity as the device is moisture sensitive. Ensure PCB layout adheres to thermal resistance specifications to maintain junction temperature within operational limits during installation.
Selection Notes
Select this model for applications requiring high-performance layer 2 functionality combined with control plane processing. The VR package provides a lead-free 516-pin PBGA option suitable for surface mount assembly. Consider the specific interface requirements for UTOPIA and PCI when designing the system architecture.
Part Context
This component belongs to the HiP7 PowerQUICC II family manufactured using 0.13-micron process technology. It offers enhanced performance and lower power consumption compared to previous generations while maintaining software compatibility with the broader PowerQUICC II processor family.
Replacement Considerations
The MPC8270VRMIBA serves as a functional substitute within the same family, offering identical core architecture but lacking UTOPIA ports and having fewer TDM interfaces. Verify pinout compatibility and peripheral availability before substitution.
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