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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
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Overview
The MPC8275ZQMIBA is a microprocessor from the PowerQUICC II family, manufactured by NXP Semiconductors (formerly Freescale Semiconductor). It features a single-core 32-bit PowerPC G2_LE processor running at a maximum clock frequency of 266 MHz. The device integrates a Communications Processor Module (CPM) and supports DRAM and SDRAM controllers. It utilizes a 516-pin PBGA package with dimensions of 27x27 mm. Operating temperatures range from 0°C to 105°C, with core voltage between 1.45 V and 1.6 V and I/O voltage between 3.135 V and 3.465 V.
Feature Summary
- Integrates a PowerPC G2_LE core with a dedicated Communications Processor Module for high-speed data handling.
- Supports multiple communication interfaces including Ethernet, USB 2.0, PCI, and various serial protocols.
- Includes on-chip L1 instruction and data caches to enhance processing efficiency.
- Designed for embedded applications requiring robust connectivity and real-time performance.
Applications
- Telecommunications infrastructure equipment
- Network routers and switches
- Industrial control systems
- Automotive telematics units
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels due to obsolete status. Confirm RoHS compliance requirements as the part may be non-compliant. Check moisture sensitivity level handling procedures before assembly. Ensure supply chain stability given potential discontinuation risks associated with legacy semiconductor products.
Selection Notes
Select this component for designs requiring PowerQUICC II architecture compatibility. Evaluate pinout compatibility with existing PCB layouts using the 516-BBGA package specifications. Consider thermal management solutions suitable for surface mount installation within the specified temperature range. Verify software support availability for the PowerPC G2_LE core and CPM functionalities.
Part Context
This microprocessor belongs to the MPC82xx series, specifically the PowerQUICC II family designed for communications applications. It succeeds earlier generations by offering integrated peripherals and improved processing capabilities. The device represents a transition point in NXP's embedded processor portfolio, bridging older PowerPC implementations with newer system-on-chip architectures.
Replacement Considerations
Consult official NXP documentation for qualified replacement parts within the MPC82xx family. Verify functional equivalence regarding interface support and pin compatibility before substitution.
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