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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8275ZQMIBA is a PowerQUICC II System-on-Chip microprocessor manufactured by NXP USA Inc. It features a G2_LE core operating at 266 MHz with a 32-bit data bus width. The device utilizes a 516-pin PBGA package and supports an I/O voltage range of 3.135 V to 3.465 V. It includes 16 KB instruction cache and 16 KB data cache, along with interfaces for Ethernet, PCI, USB, and UTOPIA.
Feature Summary
- Integrated dual-issue G2_LE core supporting floating-point operations
- Communications Processor Module (CPM) with Fast Communications Controllers (FCCs)
- On-chip memory controller supporting DRAM and SDRAM types
- PCI bridge supporting host and peripheral modes
Applications
- High-speed network routing and switching equipment
- Telecommunications infrastructure systems
- Industrial control applications requiring robust serial communication
Procurement Notes
Verify the specific ordering suffix ZQ against official documentation to confirm lead sphere packaging requirements. Confirm that the component meets all necessary environmental specifications for the intended operational temperature range before finalizing procurement decisions.
Selection Notes
Select this component when high-performance communications processing is required alongside standard PCI and Ethernet connectivity. Ensure the design accommodates the specific power supply voltages and thermal dissipation characteristics defined in the hardware specifications.
Part Context
This part belongs to the MPC82xx family of PowerQUICC II processors designed for embedded communications applications. It shares architectural similarities with other members like the MPC8270 and MPC8280 but offers specific interface configurations tailored for high-throughput data handling.
Replacement Considerations
Consult official substitution lists for compatible devices within the MPC82xx family. Verify pinout compatibility and electrical characteristics before considering alternative models.
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