MPC8280CVVUPEA

Overview

The MPC8280CVVUPEA is a PowerQUICC II integrated communications processor utilizing the EC603e core and HiPerMOS7 0.13-micron technology. It features a 450 MHz G2_LE core with separate 16 KB instruction and data caches, alongside a 300 MHz Communications Processor Module (CPM). The device includes two UTOPIA II ports, three Fast Communication Controllers (FCCs), four Serial Communication Controllers (SCCs), two Multi-channel Controllers (MCCs), a PCI bridge, and USB 2.0 support. It operates on a 1.45–1.60 V core supply and 3.135–3.465 V I/O supply within a 480-pin lead-free TBGA package.

Feature Summary

• Integrated dual-plane architecture combining an embedded PowerPC 603e core for control tasks and a RISC-based CPM for protocol offloading.
• Supports high-speed serial protocols including 10/100 Mbps Ethernet, 155 Mbps ATM via UTOPIA interfaces, and multi-channel HDLC.
• Includes dedicated hardware acceleration for Transmission Convergence (TC) layer and Inverse Multiplexing for ATM (IMA).
• Features independent clock domains allowing separate frequency optimization for the core and communication modules.

Applications

• High-end wired and wireless infrastructure communications processing
• DSLAM line cards and remote access concentrators
• Telecom switching equipment and cellular base stations
• Enterprise routers and network switches

Procurement Notes

Verify the specific suffix 'VV' indicates a lead-free package variant compliant with RoHS standards. Confirm the 'C' prefix denotes commercial temperature range operation (0°C to 70°C ambient). Ensure the ordering code matches the required 480-pin TBGA form factor. Cross-reference the revision level against the latest datasheet to confirm pinout compatibility. Validate that the component source is authorized to prevent counterfeit risks.

Selection Notes

Select this model when system requirements demand integrated ATM support via UTOPIA II and TC layer hardware acceleration. It is suitable for designs requiring simultaneous handling of control plane logic and high-throughput data forwarding. Consider the power dissipation characteristics under maximum clock configurations. Evaluate thermal management needs given the junction-to-ambient resistance values for the TBGA package.

Part Context

This component belongs to the NXP PowerQUICC II family, specifically the MPC8280 series designed for next-generation communications infrastructure. It succeeds earlier generations by offering higher performance through 0.13-micron process technology while reducing power consumption. The device maintains software compatibility with the broader PowerQUICC II ecosystem, facilitating migration from legacy designs.

Replacement Considerations

Public confirmed substitute part numbers: MPC8280ZUQLDA, MPC8280CVVQLDA.