MPC8280ZUUPEA

Overview

The MPC8280ZUUPEA is a PowerQUICC II integrated communications processor manufactured by NXP USA Inc. It utilizes the G2_LE core, a version of the EC603e microprocessor, operating at frequencies up to 450 MHz. The device features separate 16 KB instruction and data caches with LRU replacement algorithms. It includes a Communications Processor Module (CPM) with two Fast Communication Controllers (FCCs), four Serial Communication Controllers (SCCs), two Multi-Channel Controllers (MCCs), and two UTOPIA II ports. The SoC integrates a PCI bridge compliant with Specification Revision 2.2, supporting frequencies up to 66 MHz, and a USB 2.0 controller. It is housed in a 480-pin TBGA package.

Feature Summary

• Dual-issue integer G2_LE core with floating-point unit and support for bus snooping
• Integrated Communications Processor Module (CPM) handling serial protocols including Ethernet, ATM, and HDLC
• PCI host bridge or peripheral capabilities with DMA channels and hot-swap support
• USB 2.0 full/low rate controller supporting host and slave modes

Applications

• DSLAM line cards
• Enterprise routers
• Wireless base station controllers

Procurement Notes

Verify the specific silicon revision and mask number against project requirements, as impedance selection on the 60x bus may vary depending on the silicon version. Confirm that the leaded package variant aligns with environmental compliance standards if RoHS is mandatory. Ensure power supply sequencing adheres to the recommended guidelines where VDD/VCCSYN must not exceed VDDH by more than 0.4 V during normal operation.

Selection Notes

Select this component when high integration of communication interfaces such as UTOPIA II and multiple TDM ports is required within a single chip. Consider the separate power supplies for internal logic and I/O to optimize power consumption. Evaluate the need for specific clock multiplication ratios between the G2_LE core and CPM to balance performance and thermal constraints. Verify compatibility with existing memory controllers for SDRAM and DRAM interfaces.

Part Context

This part belongs to the MPC8280 family of PowerQUICC II processors, which also includes the MPC8270 and MPC8275. These devices are built using the .13µm HiP7 process technology. The ZU package designation indicates a 480-pin Thin Ball Grid Array with leaded construction. Other variants in the family utilize different packages such as VR or ZQ, offering alternative pin counts and lead-free options.

Replacement Considerations

Public confirmed substitute part numbers: None.