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Product Detailed Parameters
- Description:IC MPU MPC83XX 333MHZ 473MAPBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e300c3
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:333MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:473-LFBGA
- Supplier Device Package:473-MAPBGA (19x19)
- Additional Interfaces:DUART, HSSI, I2C, MMC/SD/SDIO, SPI
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Overview
The MPC8308CVMAFD is a PowerQUICC II Pro host processor featuring an e300c3 core operating up to 400 MHz. It integrates dual three-speed Ethernet MACs, DDR2 SDRAM controller, PCI Express interface, USB 2.0, and IEEE 1588v2 time synchronization. The device utilizes a 473-pin MAPBGA package with dimensions of 19 mm x 19 mm.
Feature Summary
- Integrates dual three-speed Ethernet controllers supporting MII and RGMII interfaces for wired network connectivity.
- Includes integrated IEEE 1588 version 2 hardware support for precise clock synchronization in time-sensitive applications.
- Features a high-performance e300c3 core based on Power Architecture technology with dedicated instruction and data caches.
Applications
- Industrial control systems
- Building energy management controllers
Procurement Notes
Verify the specific suffix CVMAFD against official NXP documentation to confirm package type and temperature range. Ensure compatibility with existing board designs regarding power sequencing and voltage levels before procurement.
Selection Notes
Select this component for applications requiring low-power operation combined with high integration. It supports both standard and extended temperature ranges. Verify that the system design accommodates the required supply voltages and pin configurations.
Part Context
This part belongs to the MPC8308 family within the PowerQUICC II Pro series. It extends the family by offering higher CPU performance and faster interfaces while maintaining cost-effectiveness. The device is designed to meet requirements for time-to-market and reduced package size.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers. Cross-reference ordering suffixes to ensure functional equivalence and package compatibility.
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