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Product Detailed Parameters
- Description:IC MPU MPC83XX 267MHZ 516TEPBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e300c3
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:267MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA Exposed Pad
- Supplier Device Package:516-TEPBGA (27x27)
- Additional Interfaces:DUART, HSSI, I2C, PCI, SPI
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Overview
The MPC8313VRADDC is a PowerQUICC II Pro microprocessor featuring the e300c3 core operating at 266 MHz. It integrates dual Gigabit Ethernet controllers, DDR1/DDR2 memory support, PCI interfaces, and USB 2.0 capabilities within a 516-TEPBGA package. Designed for industrial environments, it supports an operating temperature range of 0 to 105°C.
Feature Summary
- Integrates a dedicated security engine (SEC 2.2) for hardware-accelerated cryptographic operations including DES, AES, and SHA algorithms.
- Features dual enhanced three-speed Ethernet controllers supporting IEEE 1588 precise time synchronization protocols.
- Includes a high-performance crossbar architecture enabling simultaneous access between the processor core, DMA controllers, and peripheral buses.
Applications
- Networking switches and line cards
- Industrial controllers
- Wireless LANs (WLANs)
- VPN routers
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm revision status against official documentation as this model may be subject to obsolescence notices. Ensure supply chain integrity by validating lot codes and packaging seals upon receipt.
Selection Notes
Evaluate system requirements against the integrated peripherals to minimize external component count. Consider power management constraints given the specific voltage domains required for core and I/O supplies. Assess thermal dissipation needs based on the estimated power consumption profiles provided in the datasheet.
Part Context
This component belongs to the NXP PowerQUICC II Pro family, designed for cost-effective, low-power host processing applications. It extends previous generations with higher performance and faster interfaces while maintaining backward software compatibility for easier migration from legacy designs.
Replacement Considerations
Consult official replacement lists for obsolete part numbers. Verify pinout and register compatibility before substituting with newer revisions or alternative series processors to ensure seamless integration into existing hardware architectures.
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