MPC8313ZQADDC

Overview

The MPC8313ZQADDC is a microprocessor from the PowerQUICC II Pro family, utilizing a single-core e300c3 processor with a 32-bit data bus. It operates at a maximum clock frequency of 266 MHz and features integrated L1 instruction and data caches of 16 kB each. The device supports DDR1/DDR2 SDRAM memory types and includes interfaces such as Ethernet, GPIO, I2C, SPI, UART, and USB. It functions within an operating temperature range of -40°C to +105°C and utilizes a TEPBGAII-516 package.

Feature Summary

• Integrates a high-performance e300c3 core for efficient processing tasks
• Supports multiple communication protocols including Ethernet and USB
• Compatible with DDR1 and DDR2 memory standards
• Operates reliably across extended industrial temperature ranges

Applications

• Networking switches and line cards
• Wireless LANs (WLANs)
• Network access servers (NAS)
• VPN routers
• Industrial controllers

Procurement Notes

Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity and moisture sensitivity handling procedures before assembly. Review latest errata sheets for known silicon revisions. Ensure supply chain partners provide traceable documentation. Validate compatibility with existing board designs regarding voltage levels and pin configurations.

Selection Notes

Select this model for applications requiring robust networking capabilities and industrial-grade thermal performance. Consider the e300c3 core architecture for specific instruction set requirements. Evaluate interface availability against system connectivity needs. Assess power consumption profiles relative to system constraints. Verify package dimensions fit within mechanical enclosure specifications.

Part Context

This component belongs to the MPC8313E series, designed as a cost-effective host processor for printing, imaging, and consumer electronics. It extends the PowerQUICC family by adding higher CPU performance and faster interfaces. The processor addresses time-to-market and power consumption requirements while maintaining a compact package size suitable for space-constrained embedded systems.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.