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Product Detailed Parameters
- Description:IC MPU MPC83XX 400MHZ 620HBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e300
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:400MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (3)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:620-BBGA Exposed Pad
- Supplier Device Package:620-HBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, SPI
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Overview
The MPC8343CZQAGDB is a PowerQUICC II Pro integrated host processor based on the embedded PowerPC e300 core. It operates at up to 400 MHz and features a 32-bit superscalar architecture with 32-Kbyte instruction and data caches. The device integrates dual three-speed Ethernet controllers, dual PCI interfaces, DDR1/DDR2 SDRAM memory controllers, and USB 2.0 dual-role capabilities. An integrated security engine supports various cryptographic algorithms. It utilizes a 672-pin TBGA package.
Feature Summary
- Integrated high-performance e300 processor core with dynamic power management
- Dual three-speed Ethernet controllers supporting multiple physical interfaces
- Integrated security engine for hardware-accelerated encryption and authentication
- Support for DDR1 and DDR2 SDRAM with ECC capabilities
Applications
- Ethernet routers and switches
- Wireless LAN (WLAN) devices
- Network storage systems
- Industrial control equipment
Procurement Notes
Verify silicon revision level before procurement; this document applies to revision 3.x silicon and later. Confirm RoHS compliance status as older revisions may be non-compliant. Ensure ordering suffixes match the specific package and temperature requirements. Check for any published errata relevant to the specific silicon revision prior to final design integration.
Selection Notes
Select this component for applications requiring high integration of networking and security functions. Consider the 672-pin TBGA package size and thermal dissipation requirements. Verify compatibility with existing software ecosystems based on the Power Architecture technology. Evaluate power consumption profiles against available cooling solutions for the target operating environment.
Part Context
This part belongs to the MPC83xx family, specifically the PowerQUICC II Pro series. It serves as an upgrade to the previous PowerQUICC II generation, offering enhanced performance through the e300 core. The family targets communication and embedded applications requiring robust connectivity and processing capabilities within a single system-on-chip solution.
Replacement Considerations
Consult official documentation for compatible substitutes within the MPC83xx family. Verify pinout and register compatibility if replacing earlier revisions like the MPC8343E. Ensure that any alternative part number meets the same package and electrical specifications.
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