— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:POWERQUICC II PRO PROCESSOR
- Series:*
- Mfr:NXP USA Inc.
- Package:Bulk
- Core Processor:-
- Number of Cores/Bus Width:-
- Speed:-
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:-
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:-
- Operating Temperature:-
- Security Features:-
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC8343ECZQAGDB is a PowerQUICC II Pro integrated communications processor based on the e300 system-on-chip architecture. It features an enhanced 32-bit e300 core operating at clock rates up to 400 MHz, delivering 1260 MIPS performance. The device integrates DDR1/DDR2 memory controllers supporting data transfer rates up to 266 MHz with ECC support. Connectivity includes dual PCI interfaces, dual 10/100/1000 Ethernet controllers, and two high-speed USB controllers. An integrated security engine supports DES, 3DES, MD-5, SHA-1, AES, and ARC-4 algorithms. The component is housed in a 672-pin, 35 mm x 35 mm TBGA package.
Feature Summary
- Enhanced e300 core providing software compatibility with previous 603e-based products while offering increased L1 cache capacity.
Applications
- Ethernet routers and switches
- Wireless LAN (WLAN) devices
- Network storage systems
Procurement Notes
Verify the specific suffix 'CZQAGDB' against official NXP documentation to confirm pinout, voltage, and temperature range specifications. Confirm current manufacturing status as this series may be discontinued or subject to long-term supply agreements. Ensure design-in compliance with RoHS and REACH requirements by checking material declaration certificates for the exact part number variant.
Selection Notes
Select this processor when a highly integrated solution combining control processing with gigabit networking and security acceleration is required. The e300 core ensures migration paths from legacy PowerQUICC II designs. Evaluate the 400 MHz performance ceiling against application throughput needs. Consider the 672-pin BGA package constraints for PCB layout and thermal management during the hardware design phase.
Part Context
This component belongs to the PowerQUICC II Pro family, representing an upgrade to the widely used PowerQUICC II series. It utilizes the scalable e300 SoC platform, allowing for modular feature integration. The architecture balances high-performance processing with advanced peripherals like DDR2 memory and multiple high-speed I/O interfaces for communication applications.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers within the MPC834XE family. Verify form, fit, and function compatibility before transitioning to alternative variants.
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