— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC83XX 533MHZ 672LBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC e300
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:533MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:672-LBGA
- Supplier Device Package:672-LBGA (35x35)
- Additional Interfaces:DUART, I2C, PCI, SPI
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Overview
The MPC8349EVVAJDB is a PowerQUICC II Pro integrated host processor featuring an embedded e300 core operating up to 533 MHz. It includes dual three-speed Ethernet controllers, dual PCI interfaces, and a DDR/DDR2 memory controller supporting ECC. The device integrates a security engine for cryptographic acceleration, dual USB controllers, and a local bus controller. It utilizes a 672-pin LBGA package with 1.2 V core voltage and 3.3 V I/O.
Feature Summary
- Integrated security engine supporting multiple encryption algorithms
- Dual three-speed Ethernet controllers with hardware offloading
- Support for DDR1 and DDR2 SDRAM with error correction
- Dual PCI interfaces with host and agent capabilities
Applications
- Ethernet routers and switches
- Wireless LAN devices
- Network storage systems
- Industrial control equipment
Procurement Notes
Verify the specific silicon revision level required for your design, as documentation accuracy varies by revision. Confirm that the 672-pin LBGA footprint matches your PCB layout constraints. Ensure power sequencing adheres to the requirement of applying core voltage before I/O supplies to prevent contention during startup.
Selection Notes
Select this component when high integration of networking peripherals and security features is required within a single chip. It is suitable for applications needing robust Ethernet connectivity and hardware-accelerated data protection. Consider the thermal dissipation requirements associated with the TBGA/LBGA packaging in dense designs.
Part Context
This part belongs to the MPC8349E PowerQUICC II Pro family, designed as a successor to the PowerQUICC II series. It replaces older architectures by integrating system logic directly onto the die, reducing latency between the core and peripherals. The e300 core provides software compatibility with previous generations while offering enhanced performance.
Replacement Considerations
MPC8349ECVVAJDB
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