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Product Detailed Parameters
- Description:IC MPU MPC83XX 533MHZ 672LBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC e300
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:533MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:672-LBGA
- Supplier Device Package:672-LBGA (35x35)
- Additional Interfaces:DUART, I2C, PCI, SPI
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Overview
The MPC8349EVVAJFB is a PowerQUICC II Pro integrated host processor featuring an embedded PowerPC e300 core operating at 533 MHz. It utilizes a 672-LBGA package (35x35 mm) and supports DDR/DDR2 memory controllers with ECC. The device integrates dual three-speed Ethernet controllers, dual PCI interfaces, dual USB 2.0 controllers, and a hardware security engine. Operating temperatures range from 0°C to 105°C.
Feature Summary
- Integrated hardware security engine supporting multiple encryption algorithms
- Dual three-speed Ethernet controllers for high-speed networking
- Support for DDR and DDR2 SDRAM with error correction capabilities
- Dual PCI interfaces providing flexible system connectivity
Applications
- Ethernet routers and switches
- Industrial control systems
- Network storage devices
- Wireless LAN equipment
Procurement Notes
Verify the specific silicon revision level required for your design, as documentation accuracy varies by revision. Confirm that the 672-LBGA footprint matches your PCB layout constraints. Ensure power sequencing adheres to the specified requirements for core and I/O voltages to prevent contention during startup.
Selection Notes
Select this component when a highly integrated SoC with dedicated hardware security and dual Gigabit Ethernet is required. It is suitable for applications needing robust real-time processing alongside network protocol handling. Consider the thermal dissipation characteristics of the LBGA package for your enclosure design.
Part Context
This part belongs to the NXP PowerQUICC II Pro family, designed for communication and embedded applications. It represents an evolution of the PowerQUICC II series, offering increased integration on a single chip. The e300 core provides software compatibility with previous generations while enhancing performance through larger caches.
Replacement Considerations
Consult official replacement lists for obsolete parts. Verify pinout and voltage compatibility if substituting with other MPC83xx variants.
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