— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC83XX 533MHZ 672LBGA
- Series:MPC83xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC e300
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:533MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:672-LBGA
- Supplier Device Package:672-LBGA (35x35)
- Additional Interfaces:DUART, I2C, PCI, SPI
Download product information
Overview
The MPC8349VVAJFB is a PowerQUICC II Pro integrated host processor manufactured by NXP USA Inc. It features a single-core 32-bit PowerPC e300 processor running at 533MHz. The device utilizes a 672-LBGA package with dimensions of 35x35 mm. It supports DDR and DDR2 RAM controllers, dual Ethernet interfaces, and dual USB 2.0 controllers with PHY. I/O voltages include 1.8V, 2.5V, and 3.3V. Operating temperature ranges from 0°C to 105°C (TA).
Feature Summary
- Integrates an enhanced PowerPC e300 core for high-performance processing.
- Includes dedicated security engine with cryptography and random number generation capabilities.
- Supports dual data rate memory interfaces for flexible system design.
- Provides multiple communication interfaces including Ethernet, USB, PCI, and SPI.
Applications
- Ethernet routers and switches
- Wireless LAN devices
- Network storage systems
Procurement Notes
Verify the specific suffix against official documentation to confirm pinout and voltage compatibility. Confirm RoHS compliance status as manufacturing processes evolve. Check for obsolescence notices or end-of-life declarations from NXP. Ensure the supplier provides valid traceability documents. Validate that the component matches the exact datasheet revision required for your hardware design.
Selection Notes
Select this component when a robust embedded processor with integrated networking peripherals is required. Consider the 672-pin BGA package constraints during PCB layout. Evaluate thermal management requirements for the 0°C to 105°C operating range. Verify that the system memory interface aligns with the supported DDR/DDR2 standards. Ensure software tools support the PowerPC e300 architecture.
Part Context
This part belongs to the MPC83xx series of PowerQUICC processors. These devices are designed for communications and networking applications. They combine a high-performance processor core with extensive system-level integration. The series targets cost-effective solutions for industrial and consumer electronics.
Replacement Considerations
Consult NXP documentation for direct cross-references within the MPC8349 family. Verify mechanical footprint compatibility if substituting with similar LBGA packages. Review electrical specifications to ensure signal integrity matches the original design requirements.
ChipApex | Global Electronic Components Supplier







