— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC83XX 667MHZ PBGA689
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e300c4s
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:SATA 3Gbps (2)
- USB:USB 2.0 + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 125°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:689-BBGA Exposed Pad
- Supplier Device Package:689-TEPBGA II (31x31)
- Additional Interfaces:DUART, I2C, MMC/SD, PCI, SPI
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Overview
The MPC8377VRALG is a PowerQUICC II Pro microprocessor based on the e300c4s core. It features a 32-bit data bus and operates at a maximum clock frequency of 667 MHz. The device includes 32 kB L1 instruction cache and 32 kB L1 data cache. It utilizes a TEPBGA-689 package with surface mount installation. Operating voltage is 1 V, with I/O voltages supporting 1.8 V, 2.5 V, and 3.3 V. The operating temperature range spans from -40 C to +125 C.
Feature Summary
- Integrates dual enhanced three-speed Ethernet controllers for network connectivity
- Includes integrated security engine for hardware acceleration of encryption algorithms
- Supports high-speed interfaces including PCI Express and Serial ATA
- Features USB 2.0 dual-role controller with host and device functionality
Applications
- Printing systems main CPUs and I/O processors
- Networking switches and line cards
- Wireless LANs (WLANs)
- Network access servers (NAS)
- VPN routers
Procurement Notes
Verify component authenticity through authorized NXP channels. Confirm datasheet revision and lot traceability. Check for moisture sensitivity level compliance during storage. Validate RoHS status against current regulatory requirements. Ensure ordering suffix matches specific performance or packaging variants.
Selection Notes
Evaluate thermal management capabilities for the specified temperature range. Verify power supply sequencing requirements for core and I/O voltages. Assess memory controller compatibility with DDR1 or DDR2 SDRAM types. Consider software migration paths from previous PowerQUICC generations. Review interrupt controller configuration for system integration needs.
Part Context
This processor belongs to the PowerQUICC II Pro family designed for cost-effective, low-power applications. It extends the PowerQUICC architecture with higher CPU performance and faster interfaces. The chip targets printing, imaging, consumer, and industrial sectors. It offers backward compatibility with earlier designs while adding new high-speed connectivity options.
Replacement Considerations
NXP recommends using Power Architecture families such as T1013 or Arm Architecture families like LS1012 and LS1023 for new designs.
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