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Product Detailed Parameters
- Description:IC MPU MPC83XX 667MHZ PBGA689
- Series:MPC83xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC e300c4s
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:SATA 3Gbps (4)
- USB:USB 2.0 + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:689-BBGA Exposed Pad
- Supplier Device Package:689-TEPBGA II (31x31)
- Additional Interfaces:DUART, I2C, MMC/SD, PCI, SPI
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Overview
The MPC8379CVRALGA is a microprocessor from the PowerQUICC II Pro family, manufactured by NXP Semiconductors. It features a single-core PowerPC e300c4s processor with a maximum clock frequency of 667 MHz and a 32-bit data bus width. The device utilizes a 689-TEPBGA package and operates within a temperature range of -40°C to +125°C. It includes 32 kB L1 instruction and data caches, supports DDR/DDR2 memory controllers, and integrates interfaces such as Ethernet, I2C, PCIe, SPI, UART, and USB.
Feature Summary
- Integrates a high-performance Power Architecture e300c4s core for system processing
- Supports dual Gigabit Ethernet controllers with high-speed LAN interconnectivity
- Includes integrated security engine supporting AES and DES/3DES encryption algorithms
Applications
- Industrial control systems
- Communication equipment
- Network storage arrays
Procurement Notes
Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance and moisture sensitivity level (MSL 3) handling requirements during assembly. Validate package integrity and pin configuration against the 689-TEPBGA specification before integration into new designs.
Selection Notes
Select this component for applications requiring robust security features and high-speed networking capabilities within an embedded environment. Ensure compatibility with existing DDR/DDR2 memory architectures and verify that the operating temperature range meets the specific environmental constraints of the target deployment scenario.
Part Context
This part belongs to the MPC83xx series, designed for cost-effective and high-integration communication solutions. It represents a transition point in the PowerQUICC portfolio, offering enhanced security and peripheral integration compared to earlier generations while maintaining compatibility with established software ecosystems.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consider reviewing the Power Architecture T1013 or Arm LS1012/LS1023 models as recommended alternatives for new designs.
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