— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC83XX 667MHZ PBGA689
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC e300c4s
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:Security; SEC 3.0
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:SATA 3Gbps (4)
- USB:USB 2.0 + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:689-BBGA Exposed Pad
- Supplier Device Package:689-TEPBGA II (31x31)
- Additional Interfaces:DUART, I2C, MMC/SD, PCI, SPI
Download product information
Overview
The MPC8379ECVRALGA is a PowerQUICC II Pro microprocessor featuring a single e300 core operating at 667 MHz. It utilizes a 32-bit data bus and includes 32 kB L1 instruction and 32 kB L1 data cache. The device operates on a 1.05 V supply voltage with I/O voltages of 1.8 V, 2.5 V, or 3.3 V. It supports interfaces including Ethernet, PCIe, SPI, UART, USB, and I2C. The component is housed in a TEPBGA-689 package and functions within a temperature range of -40°C to +125°C.
Feature Summary
- Integrates dual Gigabit Ethernet controllers for high-speed network connectivity
- Includes integrated security engine supporting encryption algorithms such as AES and DES/3DES
- Features an enhanced local bus controller supporting boot from NAND and NOR flash memory
Applications
- Network attached storage systems
- Wireless access points
- SMB routers
- Printers
Procurement Notes
Verify the specific suffix 'ANGA' against official NXP documentation to confirm the exact clock speed variant and package details. Confirm RoHS compliance status and moisture sensitivity level requirements before integration. Check for any errata documents related to the MPC8379E family that may impact system design or software compatibility.
Selection Notes
Select this component for applications requiring high integration of networking and storage controllers on a single chip. The e300 core provides sufficient performance for SMB and consumer applications. Ensure the design accommodates the required DDR1/DDR2 memory interface and validates the thermal characteristics for the specified operating temperature range.
Part Context
This part belongs to the MPC837xE family of PowerQUICC II Pro processors. These devices are built on 90 nm process technology and are designed to offer cost-effective System-on-Chip solutions. The family targets small-to-medium business and consumer markets by combining processing power with integrated peripherals.
Replacement Considerations
NXP recommends using Power Architecture T1013 or Arm Architecture LS1012/LS1023 families as replacements.
ChipApex | Global Electronic Components Supplier








