— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC8XX 66MHZ 256BGA
- Series:MPC8xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:MPC8xx
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:66MHz
- Co-Processors/DSP:Communications; CPM
- RAM Controllers:DRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10Mbps (1)
- SATA:-
- USB:USB 1.x (1)
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 95°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:256-BBGA
- Supplier Device Package:256-PBGA (23x23)
- Additional Interfaces:HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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Overview
The MPC850DEVR66BU is a microprocessor from the PowerQUICC family, featuring an embedded single-issue 32-bit MPC8xx core. It integrates a Communications Processor Module (CPM) with up to eight kilobytes of dual-port RAM and supports Ethernet, USB, and PCMCIA interfaces. The device operates at a maximum clock frequency of 66 MHz with a 32-bit data bus width. It utilizes a 256-pin PBGA package and functions within a voltage range of 3.0 to 3.6 volts.
Feature Summary
- Integrates a 32-bit RISC communications processor for off-loading peripheral tasks
- Supports multiple serial channels including Ethernet and Universal Serial Bus
- Includes memory management units with translation lookaside buffers
- Features advanced on-chip emulation debug capabilities
Applications
- Cost-sensitive remote-access applications
- Telecommunications equipment
- Networking products
- Controller applications requiring integrated communications
Procurement Notes
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm the specific suffix indicates the correct package variant and operating temperature range. Review the latest datasheet revision for any updates to electrical specifications or mechanical dimensions before finalizing procurement orders.
Selection Notes
Select this model when system requirements include integrated Ethernet and USB connectivity alongside a dedicated communications processor. Ensure the design accommodates the 256-pin BGA footprint and provides adequate thermal management for the specified junction temperature limits. Verify compatibility with existing PowerQUICC software ecosystems and development tools.
Part Context
This component belongs to the MPC850 family of integrated communications processors designed by Freescale Semiconductor, now NXP Semiconductors. The MPC850 series targets networking and telecommunications markets by combining a high-performance PowerPC core with specialized hardware for protocol processing and interface management.
Replacement Considerations
Consult official documentation for direct pin-compatible substitutes within the MPC850 family, such as the MPC850DEZQ66BUR2. Verify functional equivalence regarding supported protocols and memory configurations before implementing any cross-references.
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