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Product Detailed Parameters
- Description:IC MPU MPC8XX 66MHZ 256BGA
- Series:MPC8xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:MPC8xx
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:66MHz
- Co-Processors/DSP:Communications; CPM
- RAM Controllers:DRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10Mbps (1)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 100°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:256-BBGA
- Supplier Device Package:256-PBGA (23x23)
- Additional Interfaces:HDLC/SDLC, PCMCIA, SPI, UART
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Overview
The MPC852TCZT66A is a microprocessor based on the PowerPC architecture, featuring an embedded MPC8xx core operating up to 100 MHz with a 66-MHz external bus. It utilizes a 1.8-V core voltage and 3.3-V I/O operation with 5-V TTL compatibility. The device integrates a System Integration Unit (SIU) and a Communications Processor Module (CPM). Key specifications include 4-Kbyte instruction and data caches, a 32-entry TLB, and an 8-Kbyte dual-port RAM within the CPM.
Feature Summary
- Integrates a 32-bit RISC controller with communication-specific commands for continuous transmission and reception.
- Includes a Fast Ethernet Controller (FEC) supporting full 10-Mbps operation via IEEE 802.3 standard.
- Features a PCMCIA interface compliant with release 2.1, supporting independent socket access.
- Provides debug capabilities with eight comparators for instruction address, data address, and data watchpoints.
Applications
- Ethernet routers and hubs
- VoIP clients
- WiFi access points
- CPE equipment
Procurement Notes
Verify the specific suffix 'A' against official documentation to confirm any functional or electrical differences from the base MPC852T model. Ensure that the required power sequencing between VDDL and VDDH is strictly maintained during power-on reset and power-down phases to prevent forward-biasing of ESD protection diodes and ensure long-term reliability.
Selection Notes
Select this component for applications requiring integrated communications control and Ethernet handling. Consider the 1.8-V core and 3.3-V I/O requirements when designing power supplies. Evaluate thermal management needs based on the junction-to-ambient resistance values provided in the datasheet, as performance varies with board layer count and airflow conditions.
Part Context
This part belongs to the MPC860 PowerQUICC family derivatives. It is designed as a versatile one-chip integrated microprocessor and peripheral combination. The device is built on 0.18-micron technology and implements the PowerPC architecture definition with memory management units and cache support.
Replacement Considerations
Consult the manufacturer's product summary page for published errata or updates. Verify compatibility with other members of the MPC860 PowerQUICC family if cross-referencing similar devices.
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