— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 800MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500v2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:800MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 90°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, HSSI, I2C, PCI
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Overview
The MPC8533EVJANGA is a PowerQUICC III integrated processor featuring a single 32-bit e500v2 core operating at 800 MHz. It utilizes a 783-FCPBGA package with dimensions of 29x29 mm and supports an operating temperature range of 0°C to 90°C. The device integrates DDR/DDR2 memory controllers, dual enhanced three-speed Ethernet controllers (eTSEC), PCI Express interfaces, and a dedicated security engine.
Feature Summary
- Integrated security engine supporting DES, 3DES, AES, RSA, SHA, and RNG algorithms for hardware-accelerated data protection.
- Dual enhanced three-speed Ethernet controllers providing 10/100/1000 Mbps connectivity with TCP/IP checksum acceleration.
- Flexible L2 cache/SRAM architecture offering full ECC support and configurable modes for instruction or data caching.
- PCI Express interfaces supporting multiple link widths with selectable root complex or endpoint operation.
Applications
- Enterprise networking equipment
- Industrial control systems
- Point-of-sale terminals
Procurement Notes
Verify the specific suffix 'EVJANGA' against official NXP documentation to confirm exact speed grade, package variant, and RoHS compliance status. Confirm component obsolescence status prior to procurement planning. Ensure design compatibility with required I/O voltage levels and power sequencing requirements specified in the datasheet.
Selection Notes
Select this component for applications requiring high-performance embedded processing with integrated security features. Evaluate system requirements against the available interface options including PCIe, PCI, and local bus. Consider thermal management needs based on the specified junction temperature range and power dissipation characteristics under load.
Part Context
This part belongs to the MPC85xx family of PowerQUICC III processors designed by NXP USA Inc. These devices are built on Power Architecture technology and target communication and industrial markets. The MPC8533E variant specifically balances performance with low power consumption using advanced manufacturing processes.
Replacement Considerations
Public confirmed substitute part numbers: None identified in source material.
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