— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 1.0GHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500v2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 90°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, HSSI, I2C, PCI
Download product information
Overview
The MPC8533EVTAQGA is a PowerQUICC III integrated processor featuring an e500 core with speeds up to 1.0 GHz, delivering 2,240 MIPS at peak frequency. It includes a 256-Kbyte L2 cache/SRAM, dual enhanced three-speed Ethernet controllers (eTSECs), and three PCI Express interfaces (two x4, one x1). The device integrates a security engine supporting DES, AES, RSA, and other algorithms, alongside DDR/DDR2 memory controllers with ECC support. Operating conditions include a 1.0 V core voltage and junction temperatures from 0°C to 90°C.
Feature Summary
- Integrated security engine for hardware-accelerated encryption and authentication
- Dual high-performance Ethernet controllers with TCP/IP acceleration
- Flexible L2 cache configurable as SRAM with full ECC protection
- Multiple high-speed interconnects including PCI Express and PCI
Applications
- Enterprise networking equipment
- Industrial control systems
- Advanced multifunction printers
- Automotive electronic control units
Procurement Notes
Verify the specific suffix 'VTAQGA' against official NXP documentation to confirm package type, temperature range, and RoHS compliance status. Ensure power sequencing requirements are met during design validation. Confirm availability status as this component family may have reached end-of-life or transitioned to alternative series.
Selection Notes
Select this processor for applications requiring high integration of communication interfaces and security features within a single SoC. Consider the 783-pin FC-BGA package constraints and thermal management needs for operation up to 90°C. Evaluate system memory requirements against the supported DDR and DDR2 configurations.
Part Context
This component belongs to the Freescale/NXP PowerQUICC III family, designed for embedded communications and control applications. It utilizes Power Architecture technology and targets markets demanding robust connectivity and data processing capabilities in a compact form factor.
Replacement Considerations
Consult official NXP documentation for direct pin-compatible or functional substitutes within the MPC85xx series. Verify compatibility regarding core speed, peripheral count, and package dimensions before transitioning designs.
ChipApex | Global Electronic Components Supplier








