— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 1.0GHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC e500v2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 90°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, HSSI, I2C, PCI
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Overview
The MPC8533VJAQGA is a PowerQUICC III integrated processor built on the e500 core. It features a 7-stage pipeline with out-of-order execution and double-precision floating-point APU. The device includes a 256-Kbyte L2 cache/SRAM, DDR/DDR2 memory controller with ECC support, and an integrated security engine for cryptographic acceleration. Connectivity options include two enhanced three-speed Ethernet controllers (eTSECs), PCI Express interfaces, and a PCI controller. It utilizes a 783-pin FC-BGA package.
Feature Summary
- High-performance embedded e500 core with advanced caching and floating-point capabilities
- Integrated security engine supporting multiple encryption algorithms and random number generation
- Dual enhanced three-speed Ethernet controllers with hardware checksum acceleration
- Flexible high-speed interconnects including PCI Express and PCI
Applications
- Enterprise networking equipment
- Industrial control systems
- Point of Sale (POS) terminals
- Building energy management controllers
- Automotive electronics and engine control units
Procurement Notes
Verify the specific suffix VJAQGA against official NXP documentation to confirm pinout, voltage, and temperature grade specifications. Ensure compatibility with existing board designs regarding the 783-pin FC-BGA package dimensions and power sequencing requirements. Confirm that the component meets all necessary regulatory standards for the intended deployment environment.
Selection Notes
Select this processor for applications requiring high integration of communication interfaces and security processing. Consider the e500 core performance and available cache configurations for complex control plane tasks. Evaluate the supported memory types and interface speeds to ensure they align with system throughput requirements. Verify thermal management solutions are adequate for the specified operating junction temperatures.
Part Context
This component belongs to the PowerQUICC III family of processors designed by NXP. These devices are based on the scalable e500 system-on-chip platform and Power Architecture technology. They are engineered to deliver gigahertz-plus communications processing performance with high integration for enterprise networking, telecom, and industrial markets.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers within the MPC8533E series or compatible PowerQUICC III devices. Verify functional equivalence and pin compatibility before substitution.
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