MPC8535BVTAKG

MPC8535BVTAKG

$122.36
  • Description:IC MPU MPC85XX 600MHZ 783FCPBGA
  • Series:MPC85xx
  • Mfr:Freescale Semiconductor
  • Package:Tray

SKU:296dddee0765 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC85XX 600MHZ 783FCPBGA
  • Series:MPC85xx
  • Mfr:Freescale Semiconductor
  • Package:Tray
  • Core Processor:PowerPC e500
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:600MHz
  • Co-Processors/DSP:-
  • RAM Controllers:DDR2, DDR3
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100/1000Mbps (2)
  • SATA:SATA 3Gbps (1)
  • USB:USB 2.0 (2)
  • Voltage - I/O:1.8V, 2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:783-BBGA, FCBGA
  • Supplier Device Package:783-FCPBGA (29x29)
  • Additional Interfaces:DUART, I2C, MMC/SD, PCI, SPI

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MPC8535BVTAKG

Overview

The MPC8535BVTAKG is a single-core, 32-bit embedded microprocessor belonging to the MPC85xx series. It utilizes the PowerPC e500 core architecture and operates at a clock speed of 600MHz. The device is housed in a 783-FCPBGA package with dimensions of 29x29 mm. It supports DDR2 and DDR3 RAM controllers and includes interfaces such as Ethernet, SATA, USB 2.0, PCI, I2C, SPI, and MMC/SD. The component functions within an operating temperature range of 0°C to 105°C.

Feature Summary

  • Integrates a high-performance PowerPC e500 processor core for embedded applications
  • Includes dedicated security co-processors for cryptographic operations
  • Supports multiple industry-standard peripheral interfaces including Gigabit Ethernet and SATA

Applications

  • Networking infrastructure equipment
  • Telecommunications base stations
  • Industrial control systems

Procurement Notes

Verify the specific suffix 'BV' against official NXP documentation to confirm the exact speed grade and commercial temperature rating. Confirm package type and pinout compatibility with existing board designs. Check current product lifecycle status as this component may be obsolete or subject to last-time buy restrictions.

Selection Notes

Select this component when a single-core PowerPC solution with integrated security features is required. Ensure the design accommodates the 783-ball flip-chip ball grid array footprint. Verify that the system memory requirements align with the supported DDR2 and DDR3 controller specifications.

Part Context

This part is manufactured by NXP Semiconductors following the acquisition of Freescale Semiconductor. It belongs to the MPC85xx family of integrated communications processors designed for networking and telecommunications markets. The device implements the Power Architecture technology standard.

MPC8535BVTAKGMPC8535BVTAKG
$122.36
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