— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 667MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (1), 10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BFBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, RapidIO
Download product information
Overview
The MPC8540CVT667JC is a PowerQUICC III integrated processor featuring a 32-bit e500 core operating at 667 MHz. It utilizes a 783-pin flip-chip plastic ball grid array (FC-PBGA) package with dimensions of 29 x 29 mm and a height of 3.75 mm. The device operates within a junction temperature range of 0 to 105 °C, requiring a core supply voltage of 1.2 V ± 60 mV. Key specifications include a 64-bit address bus, 64-bit external data bus width, and support for boundary scan testing.
Feature Summary
- Integrates a high-performance 32-bit Book E-enhanced e500 core with enhanced hardware and software debug support.
- Features a 256 Kbyte L2 cache/SRAM configurable as full cache, full SRAM, or half-and-half modes with ECC support.
- Includes two three-speed Ethernet controllers supporting 10/100/1Gb speeds and a programmable RapidIO interface.
- Provides a DDR memory controller with full ECC support and a PCI/PCI-X controller compatible with PCI 2.2 and PCI-X 1.0.
Applications
- Networking infrastructure equipment
- Telecommunications transmission systems
- Wireless infrastructure applications
Procurement Notes
Verify the specific speed grade suffix '667' corresponds to the required 667 MHz core frequency. Confirm the 'VT' designation matches the commercial temperature range (0 to 105 °C). Ensure the 'JC' suffix aligns with the specified 783 FC-PBGA package requirements. Cross-reference the datasheet revision to ensure compatibility with current design constraints.
Selection Notes
Select this component when a 667 MHz processing speed is sufficient for the application's control plane tasks. The commercial temperature range suits environments without extreme cold exposure. The integration of TSECs and RapidIO makes it suitable for devices requiring mixed high-speed connectivity without external bridge chips.
Part Context
This part belongs to the Freescale/NXP PowerQUICC III family, designed for embedded networking and telecommunications. It implements the Power Architecture technology on an e500 system-on-chip platform. The MPC8540 series provides a balance of processor performance and I/O throughput for enterprise and carrier-grade applications.
Replacement Considerations
Consult official NXP documentation for qualified replacements. Verify that any substitute maintains the same 783 FC-PBGA footprint and pinout compatibility. Ensure the replacement supports the required 667 MHz clock speed and commercial temperature range.
ChipApex | Global Electronic Components Supplier







