— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 667MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (1), 10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BFBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, RapidIO
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Overview
The MPC8540PX667LC is a PowerQUICC III integrated processor featuring an e500 core operating at 667 MHz. It includes a 256 KB L2 cache/SRAM, DDR SDRAM controller with ECC, two TSECs, one FEC, PCI/PCI-X, and RapidIO interfaces. The device utilizes a 783-pin FC-BGA package and operates within a junction temperature range of 0 to 105 °C.
Feature Summary
- Integrates a high-performance 32-bit Book E-enhanced e500 core with enhanced debug support.
- Features configurable 256 KB L2 cache/SRAM with full ECC protection in both modes.
- Provides extensive connectivity via dual three-speed Ethernet controllers and PCI/PCI-X interface.
- Includes a programmable RapidIO interface unit supporting LVDS signaling and atomic operations.
Applications
- Enterprise networking equipment
- Telecom transmission and switching systems
- Industrial control applications
Procurement Notes
Verify the specific ordering suffix against official documentation to confirm frequency grade, package type, and environmental rating. Ensure compatibility with required power sequencing and voltage levels for VDD, GVDD, and OVDD rails during system design validation.
Selection Notes
Select this component for designs requiring high integration of communication interfaces and robust memory management. Consider thermal dissipation requirements due to power consumption characteristics at the specified operating frequency and ensure adequate PCB layout for the 783-pin BGA package.
Part Context
This processor belongs to the PowerQUICC III family, designed for communications and networking infrastructure. It combines system-level support for industry-standard interfaces with embedded Power Architecture processors, targeting demanding control plane processing tasks alongside data plane scalability.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers or next-generation equivalents within the PowerQUICC series that maintain pin and functional compatibility.
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