— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 1.0GHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (1), 10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BFBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, RapidIO
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Overview
The MPC8540VTAQFB is a PowerQUICC III microprocessor featuring a single e500 core with a maximum clock frequency of 1 GHz. It utilizes a 32-bit data bus and operates on a 1.2 V core supply voltage, paired with 2.5 V and 3.3 V I/O voltages. The device integrates 32 kB L1 instruction and data caches alongside a 256 kB L2 cache/SRAM. Encased in a 783-pin FC-PBGA package, it supports an operating temperature range from 0°C to +105°C.
Feature Summary
- Integrates a high-performance 32-bit Book E-enhanced e500 core with dedicated memory management unit and debug support.
- Features a flexible 256 Kbyte L2 cache/SRAM configurable for full caching, SRAM mapping, or hybrid modes with ECC protection.
- Includes dual three-speed Ethernet controllers (TSECs) supporting 10/100/1000 Mbps speeds via multiple physical interfaces.
- Provides integrated RapidIO interface unit with LVDS signaling and programmable interrupt controller compliant with OpenPIC architecture.
Applications
- Networking infrastructure equipment
- Telecommunications systems
- Wireless infrastructure applications
Procurement Notes
Verify the specific speed grade and manufacturing lot against the datasheet specifications before integration. Confirm that the power sequencing requirements for VDD, AVDD, and I/O supplies are strictly followed during system design to ensure proper device operation and reliability.
Selection Notes
Select this component for designs requiring high integration of networking interfaces and processing power within a single chip. Ensure the system board layout accommodates the 783-FCPBGA package dimensions and provides adequate thermal dissipation for the specified junction temperature limits.
Part Context
This processor belongs to the PowerQUICC III family, designed to combine system-level support for industry-standard interfaces with embedded Power Architecture processors. It serves as an integrated host processor suitable for demanding communication environments requiring robust packet switching and low-latency data handling capabilities.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers. Verify pin compatibility and electrical characteristics if considering alternative models within the same product family.
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