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MPC8541ECPXALF
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Product Detailed Parameters
- Description：IC MPU MPC85XX 667MHZ 783FCPBGA
- Series：MPC85xx
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：PowerPC e500
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：667MHz
- Co-Processors/DSP：Security; SEC
- RAM Controllers：DDR, SDRAM
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：10/100/1000Mbps (2)
- SATA：-
- USB：-
- Voltage - I/O：2.5V, 3.3V
- Operating Temperature：-40°C ~ 105°C (TA)
- Security Features：Cryptography, Random Number Generator
- Mounting Type：Surface Mount
- Package / Case：783-BBGA, FCBGA
- Supplier Device Package：783-FCPBGA (29x29)
- Additional Interfaces：DUART, I2C, PCI
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Overview
The MPC8541ECPXALF is a PowerQUICC III integrated communications processor featuring an embedded e500 core. It operates at frequencies up to 600 MHz with a 1.2 V core supply and supports DDR SDRAM via a 64-bit interface. The device includes two three-speed Ethernet controllers, PCI interfaces, and a security engine for cryptographic operations. It utilizes a 783-pin flip-chip plastic ball grid array package.
Feature Summary
- Integrates a high-performance e500 Book E-compatible core with dual-issue superscalar architecture
- Includes a dedicated security engine supporting IPSec, SSL/TLS, and IEEE 802.11i processing
- Features two three-speed Ethernet controllers (TSECs) supporting 10/100/1000 Mbps speeds
- Provides on-chip memory configurable as L2 cache or SRAM with full ECC support
Applications
- Networking infrastructure equipment
- Telecommunications systems
- Wireless infrastructure applications
Procurement Notes
Verify the specific suffix 'LF' against official NXP documentation to confirm lead-free status and RoHS compliance details. Ensure the ordering part number matches the exact speed grade and package variant required for your design specifications before finalizing procurement.
Selection Notes
Select this component for designs requiring high integration of communication peripherals and security features. Consider the 783-pin FC-BGA package constraints and the requirement for separate 1.2 V, 3.3 V, and 2.5 V power rails during system architecture planning.
Part Context
This processor belongs to the PowerQUICC III family, which combines system-level support for industry-standard interfaces with embedded Power Architecture processors. It is designed to balance processing performance with I/O system throughput for demanding network and telecom environments.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers within the PowerQUICC III family. Verify pinout compatibility and electrical characteristics when considering alternative models.
