— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 533MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:533MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI
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Overview
The MPC8541ECVTAJD is a PowerQUICC III integrated communications processor featuring an embedded e500 Book E-compatible core. It operates at a maximum clock frequency of 600 MHz with a 32-bit architecture and includes a 7-stage pipeline design. The device integrates 256 Kbytes of on-chip L2 cache/SRAM, dual three-speed Ethernet controllers (TSECs), a PCI controller, and a dedicated security engine supporting multiple encryption algorithms. It utilizes a 783-pin flip-chip plastic ball grid array (FC-PBGA) package.
Feature Summary
- Integrates a high-performance e500 core with dynamic power management capabilities
- Includes a dedicated security engine for hardware-accelerated IPSec and SSL/TLS processing
- Features two three-speed Ethernet controllers supporting 10/100/1000 Mbps interfaces
- Provides a flexible DDR memory controller with full ECC support
Applications
- Networking infrastructure equipment
- Telecommunications transmission systems
- Wireless infrastructure base stations
Procurement Notes
Verify the specific suffix 'CVTAJD' against official NXP documentation to confirm exact speed grade, temperature range, and package variant. Ensure compatibility with existing board designs regarding pinout and voltage requirements before procurement.
Selection Notes
Select this component for applications requiring high integration of communication peripherals and security features. Evaluate thermal dissipation needs based on the specified operating conditions and power consumption profiles under load.
Part Context
This part belongs to the PowerQUICC III family, designed for embedded category Power Architecture processors. It combines system-level support for industry-standard interfaces with high-performance computing cores suitable for demanding control plane tasks.
Replacement Considerations
Consult official cross-reference lists for compatible upgrades within the PowerQUICC III series. Verify functional equivalence and pin compatibility before substituting.
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