— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 667MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Bulk
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI
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Overview
The MPC8541ECVTALF is a PowerQUICC III integrated communications processor featuring an embedded e500 Book E-compatible core. It operates with a maximum clock frequency of 166 MHz and utilizes a 783-pin flip-chip plastic ball grid array (FC-PBGA) package measuring 29 x 29 mm with a 1 mm pitch. The device supports a 64-bit external data bus width and includes a 256 Kbyte on-chip L2 cache/SRAM. Recommended operating conditions specify a core supply voltage of 1.2 V and a junction temperature range up to 105 °C.
Feature Summary
- Integrates a high-performance dual-issue superscalar e500 core with single-precision floating-point operations and dynamic power management capabilities.
- Features an integrated security engine supporting multiple cryptographic algorithms including DES, AES, RSA, and elliptic curve cryptography for secure protocol processing.
- Includes two three-speed Ethernet controllers and a programmable interrupt controller compliant with OpenPIC architecture for efficient network traffic handling.
Applications
- Enterprise networking infrastructure
- Telecommunications transmission systems
- Wireless infrastructure equipment
Procurement Notes
Verify the specific suffix 'CVTALF' against official NXP documentation to confirm ceramic packaging and lead-free compliance status. Ensure compatibility with required DDR SDRAM timing specifications and power sequencing requirements before integration. Confirm that the 1.2V core voltage and 3.3V/2.5V I/O levels match the target system design constraints.
Selection Notes
Select this component for applications requiring high integration of communication peripherals alongside a powerful RISC processor core. The device balances processing performance with I/O throughput through its OCeaN switch fabric. Consider the available on-chip memory flexibility between cache and SRAM modes when designing memory architectures for latency-sensitive tasks.
Part Context
This processor belongs to the PowerQUICC III family, designed using 90nm silicon-on-insulator technology. It combines system-level support for industry-standard interfaces with embedded Power Architecture processors. The device simplifies board design by integrating multiple PCI ports, Ethernet controllers, and DMA engines into a single SoC solution.
Replacement Considerations
MPC8541EVTALDX
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