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Product Detailed Parameters
- Description:IC MPU MPC85XX 667MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI
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Overview
The MPC8541EPXALF is a PowerQUICC III integrated communications processor from the Freescale Semiconductor MPC8541E family. It integrates a PowerPC e500 core operating at 600 MHz with system logic for networking and telecommunications. The device features dual Gigabit Ethernet controllers, a 64-bit PCI controller, DDR/SDRAM memory support, and an embedded security engine. It utilizes a 783-pin flip-chip ball grid array (FCBGA) package designed for high-performance infrastructure applications.
Feature Summary
- Integrates a high-performance PowerPC e500 core for balanced processing and I/O throughput
- Includes an embedded security engine supporting standard cryptographic algorithms and random number generation
- Provides multiple interface options including dual Gigabit Ethernet and dual PCI ports
Applications
- Networking infrastructure equipment
- Telecommunications base stations
- Wireless infrastructure systems
Procurement Notes
Verify the specific suffix 'LF' against official NXP documentation to confirm lead-free status and RoHS compliance, as datasheets may list generic variants. Confirm availability through authorized channels given the component's age. Ensure the package dimensions match the 783-pin FCBGA specification required for your PCB layout.
Selection Notes
Select this component when a robust Power Architecture solution with integrated hardware security and multiple high-speed interfaces is required. It serves as a suitable replacement for legacy Freescale designs requiring dual GbE and PCI connectivity. Evaluate thermal management requirements for the 783-pin BGA package during the design phase.
Part Context
This part belongs to the PowerQUICC III family, which combines system-level support for industry-standard interfaces with embedded Power Architecture processors. The MPC8541E series is designed to simplify board design while providing high system-level bandwidth. It represents a transition point in NXP's portfolio following the acquisition of Freescale Semiconductor.
Replacement Considerations
Consult official substitution guides for compatible upgrades within the MPC85xx family. Verify pin-to-pin compatibility if considering alternative packages or higher-frequency variants.
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